FEP Process Support Engineer is responsible for guiding products through their lifecycle with high-visibility on-site customer support, including installations, system diagnoses, and service of complex semiconductor processing equipment. You will work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and you will create hypothesis experiments and design of experiments (DOE), analyze data with statistics, and compile reports with high-level conclusions. You will troubleshoot complex problems, perform root cause analyses, and resolve a variety of process engineering and customer product issues. The role spans technologies such as Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, and Implant. Responsibilities also include communicating with internal stakeholders and customers to achieve goals and build trust, and applying growing knowledge of the company’s processes to solve problems.
FEP Process Support Engineer is responsible for guiding products through their lifecycle with high-visibility on-site customer support, including installations, system diagnoses, and service of complex semiconductor processing equipment. You will work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and you will create hypothesis experiments and design of experiments (DOE), analyze data with statistics, and compile reports with high-level conclusions. You will troubleshoot complex problems, perform root cause analyses, and resolve a variety of process engineering and customer product issues. The role spans technologies such as Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, and Implant. Responsibilities also include communicating with internal stakeholders and customers to achieve goals and build trust, and applying growing knowledge of the company’s processes to solve problems.
Minimum Qualifications: Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics, or a related field; 2–4 years of experience in the semiconductor fab or equipment industry; English language proficiency.
Preferred Qualifications: Master’s degree or PhD in a related field.
Travel: Yes, up to 20% of the time.
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Minimum Qualifications: Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics, or a related field; 2–4 years of experience in the semiconductor fab or equipment industry; English language proficiency.
Preferred Qualifications: Master’s degree or PhD in a related field.
Travel: Yes, up to 20% of the time.
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Based on: FEP Process Support Engineer
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